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Sony Xperia Z5 Premium teardown reveals a dual heat pipe

Discussion in 'Sony - What's New?' started by Gsm Lab, Sep 5, 2015.

  1. Gsm Lab

    Gsm Lab Member
    damascus

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    Qualcomm's Snapdragon 810 chipset has quite a reputation for loving to overheat. On the other hand, it is that chip maker's current top of the line offering, so some smartphone makers are seeing themselves in a situation where they have to use it for their flagships.

    Case in point: Sony. The Xperia Z5 Premium goes with the Snapdragon 810, because to pair a 4K touchscreen with anything less simply wouldn't have made sense. But what about the heat? Well, it looks like Sony has found a solution.

    [​IMG]

    The image you see above is said to show a disassembled Xperia Z5 Premium, a unit which has been put through a teardown. And sitting pretty in the upper side of the phone we see a dual heat pipe, undoubtedly put there to take care of the S810's proper ventilation. Furthermore, Sony has applied a lot of thermal paste onto the innards of the Z5 Premium, in order to make things even less prone to overheating.

    So in theory we should get cooler behavior from the S810 chip inside the Z5 Premium. However, just how efficient this system turns out to be in real-life use is something that remains to be seen.

    Source (in Chinese) | Via
     
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