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New leaked cover might reveal more Huawei P8 features

Discussion in 'Huawei - What's New?' started by Princess, Feb 23, 2015.

  1. Princess

    Princess Super Moderator

    Jan 24, 2015
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    Case manufacturers have long been an abundant source of leaks for expected devices and lately this seems to be truer than ever. Most of what we know about the physical appearance of the Galaxy S6 and the HTC One (M9), currently the two most highly-anticipated devices has come from various case manufacturers, who are among the first in the industry with charts and dimensions for upcoming models.

    In much the same fashion a new case leak allegedly holds new information about Huawei's next flagship device. Rumors state that the thin translucent case from the photos is designed to fit the Huawei P8.

    If this is true then the small hunk of plastic reveals quite a bit about the future device. First of all the P8 should be impressively thin. On the right side of the case we find holes for what are undoubtedly the volume rockers and tight underneath that - the power button, so nothing extraordinary here.


    What is truly interesting is the back side of the transparent bumper. It has two very distinct holes. One small in the far upper-left corner and one significantly bigger right in the center. Now this could be indicative of a lot of things and could very well mean nothing, but usually such a large space is left uncovered to accommodate something and not simply as a design element. One possible variant might be that the Huawei P8 will come with a dual-camera setup. Another option is a biometric sensor, perhaps a fingerprint scanner and heart-rate monitor.

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    As far as we know from previous leaks the P8 will be powered by Huawei’s latest Kirin 930 chipset, which is the first to be made using a 16nm process. It will sport a 5.2″ Full HD screen as well as dual cameras from the Honor 6 Plus (the device might even get an upgrade to dual-13MP main cameras), and will pack a 2,600mAh battery. It will come with double sided gorilla glass 3 protection and a ceramic uni-body design. At 6mm, it is said to be thinner than the iPhone 6, which is 6.9mm thick.


    According to that very same rumor the device should be priced at RMB2,999($480) and be unveiled at a special event in London on April 15. The leaked specs did mention a fingerprint sensor, but it is not really visible in the accompanying image, especially where the case has left a whole to accommodate it.

    There are, of course, countless possible reasons for the discrepancy, but until Huawei clears the smoke on the flagship on March 1, take it all with a bit of salt.

    GsmDude likes this.

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